Image Sensor for Automotive Applications

Imaging chip development

• Design
• Lay-out
• Wafer processing
• Packaging
• Probing and testing
• Module building

Reliability

• Preconditioning to simulate solder reflow 260degC (3 times) at MSL3 conditions
• 1000 Temperature Cycles -50degC .. +150degC
• Temperature and Humidity Bias: 1000 operating hours at 85degC and 85% relative humidity
• Autoclave: 96h at 121degC and 100% humidity
• High Temp. Storage Life: 1000 hours at 150degC
• Electrostatic Discharge capability