Mobile Security Solution

World Thinnest Fingerprint Sensor Module



Benefits

  • Ultra-thin module height
  • Small form factor (X,Y,Z)
  • Performance enhancement
  • Scratch resistant
  • JEDEC Level 1 moisture sensitivity

Process

  • To create the structure, China Wafer Level CSP creates the 3D interconnects, assemble the sensor on the flexible substrate and encapsulates the sensor with scratch resistant material.