Design chain management
Design for Manufacturing (DFM)
Design for Cost (DFC)
Full design and verification of WL, leadframe, laminate, etc.
Electrical, thermal and mechanical characterization: SiP, RF, etc.
Quick turn prototype service
Turnkey solutions for TSV, Wire Bond and Flip Chip
High-volume manufacturing
Wafer finishing and 2/3D assembly
Wafer to wafer and die to wafer bonding, micro-joining
Integrated and SMT passives
Package and board level
Bump reliability
Underfill / EMC adhesion
Drop tests, bend tests, solder joint reliability prediction
Materials Lab
Failure Analysis
