We Pioneered China's Wafer Level Through Silicon Via (TSV) Packaging Industry
We Bridge The Infrastructure Gap
We Created China’s Largest Middle-End TSV Process Infrastructure
Our R&D Activities Remains Aligned To Meet Our Customers’ Challenges
Chinese Innovations History
China WLCSP holds a great pride in our Chinese invention history. We will continue the Chinese innovative culture to the 21st century and make China the leader of semiconductor wafer level packaging.
