WLCSP received awards for excellence of “development story of listed company” by Gusu Evening News on Dec 28 2017.

       WLCSP: 5G brings challenges to package industry
         Liu Hongjun, the vice president of WLCSP has made a speech of“Technology is people”at 2017 International mobile Phone Industry Leadership Summit in Chongqin, Dec 2, 2017.

       An introduction of WLCSP was reported by Gusu Evening News on Oct 28 2017.

       Wang Wei, Member of the CPPCC,Chairman,General Manager of China Wafer Level CSP Co., Ltd. were interviewed by Gusu Evening News on Jan 17.

       Xiao Gang, the president of the China Securities Regulatory Commission researched enterprises in Suzhou which includes China WLCSP on October 23rd 2015.

       China Semiconductor Industry Association (CSIA) interviewed Wang Wei who is CEO and Chairman of Board of Directors of China WLCSP on July 2015. It was published in magazines and website of China Integrated Circuit (CIC).